IC/半導體/LED封裝檢測解決方案WB&DB焊線AOI檢測設備

（深圳）IC/半導體/LED封裝檢測解決方案
WB&DB焊線AOI檢測設備
型號：F241/F251

主要特征 ：
1.可選的5面和6面檢查
2.2.5D深度技術
3.模塊化且靈活
4.64位操作系統
5.至強處理器
6.吞吐量從20,000上升到50,000上升
7.相機分辨率范圍從75 fps時的5百萬像素到66fps時的12百萬像素

應用范圍：
1.晶圓切割后進行檢查以檢測表面缺陷。
2.封裝分離后進行檢查，以檢測封裝，標記，引線和電鍍缺陷。

TTVISION自動光學檢測設備的檢測方式
*2D
*2.5D
*True 3D (Z5D)

F251
Wirebond AOI Machine

Features
3D Profiling Technology
Inspects Wrebond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Boll. Wedge. Stitch and Loop Parameters
Minimum Overki & UnderWI
Modular end Scalable Design
Cost Effective
high Throughput

F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts

2D AOI技術規格
·Onload /Offload
Number of Magazines 2-7 units
Substrate Size 30(W) x 150(L) - 200(W) x 300(L)mm
Handling
Camera Indexing High Speed Servo driven XY Gantry
Substrate Indexing Mi cro-Step Step per d riven Conveyor
·Inspection Hardware
Camera Resolution 12MP Color
Lighting Multi Channel LED
Optics Low Distortion Macro Lens
Controller PC-based
·Software
Inspection Software TTVISION ?
·Operating System MS Windows 64 bit OS
·Reject Handling
Electronic Mapping
Defect Classification 99 Categories